- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 7/22
Total number of patents in this class: 549
10-year publication summary
35
|
32
|
47
|
48
|
59
|
52
|
52
|
42
|
50
|
18
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1745 |
98 |
Ebara Corporation | 1951 |
21 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
19 |
Sumco Corporation | 1116 |
16 |
Applied Materials, Inc. | 16587 |
15 |
Ancora S.p.A. | 27 |
12 |
Husqvarna AB | 2824 |
11 |
Tokyo Electron Limited | 11599 |
10 |
Shin-Etsu Chemical Co., Ltd. | 5132 |
8 |
Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
8 |
Shin-Etsu Handotai Co., Ltd. | 1277 |
8 |
3m Innovative Properties Company | 18406 |
7 |
Samsung Electronics Co., Ltd. | 131630 |
6 |
Semiconductor Components Industries, L.L.C. | 5345 |
6 |
Vertical Concrete Polishing Inc. | 8 |
6 |
Corning Incorporated | 9932 |
5 |
Okamoto Machine Tool Works, Ltd. | 15 |
5 |
Siltronic AG | 395 |
5 |
SK Enpulse Co., Ltd. | 103 |
5 |
International Business Machines Corporation | 60644 |
4 |
Other owners | 274 |